Rain Tree Photonics and ATOP Corporation to Commercialize 200G/lane Transceiver Modules

　　Singapore – March 25, 2024 – Rain Tree Photonics Pte. Ltd. (RTP), a silicon photonics chip maker for hyperscale data-center and AI interconnect applications entered into a MEMORANDUM OF UNDERSTANDING (MOU) with ATOP Corporation (ATOP) to form a strategic partnership to commercialize its 200G/lane silicon photonics engines for 1.6T and beyond optical modules in both Co-Packaged Optics (CPO) and pluggable form factors. The strategic partnership builds upon prior close collaborations between the two parties in the area of CPO photonic engines, 800G-LPO, 800G-DR8 and 400G-DR4 pluggable transceiver modules.

　　The silicon photonic engines are built using RTP’s proprietary silicon photonics platform which features ultra-high bandwidth modulators and photodetectors, low insertion losses and technologies which enable high yield module packaging. ATOP’s state-of-the-art production lines, prior expertise and technology capabilities in silicon photonics modules will greatly accelerate the time to market for these 200G/lane transceiver modules.

　　RTP will also be presenting results on their 200G/lane silicon photonics platform for CPO and linear drive at OFC 2024 (OFC 2024, Tu3A.2. Xin Li, et al., “1.6 Tbps (224 Gbps/λ) Silicon Photonic Engine Fabricated with Advanced Electronic-Photonic FOWLP for Co-Packaged Optics and Linear Drive Applications”). ATOP will also be showcasing its 800G DR8 and 400G DR4 silicon photonics transceivers at OFC 2024. Dr. Toshi K. Uchida, ATOP’s chief scientist, will also deliver a speech on 200 per Lane to 1.6T optical transceivers at OFC2024 （time: March 27th, 2024 15:45-16:15；location: Theater 3）

　　About Rain Tree Photonics Pte. Ltd.

　　Cost and energy-efficient scaling of optical interconnects are increasingly becoming bottlenecks for Cloud and Artificial Intelligence (AI) applications. Rain Tree Photonics’ proprietary Silicon Photonics platform directly addresses these bottlenecks, enabling truly scalable optical interconnect solutions. As a Silicon Photonics chipmaker, Rain Tree Photonics (RTP) fully leverages the fabless eco-system and extends beyond with a unique fabless++ approach. In conjunction with its DFM Silicon Photonics platform and technology IPs, this enables RTP to deliver high-performance, low-power products in volume at low cost.  By overcoming various challenges faced by customers when using silicon photonic chips, RTP is able to greatly reduce the development cycle time of customers and help them bring their products to the market quickly. A spin-off from IME, A*STAR, RTP is backed by renowned venture capitalist firms. The team includes a good mix of silicon photonics experts, industry veterans and talented PhDs from world-class universities. RTP is headquartered in Singapore, with a presence in China.

　　For more information, please visit www.raintreephotonics.com.

　　       Rain Tree Photonics Pte. Ltd.

　　       Press Contact:

　　pr@raintreephotonics.com