Liobate Completes Nearly 100 Million Yuan Series A+ Financing

　　ICC Information news -- Recently, Liobate Technologies Limited (Liobate), an innovative enterprise in the field of photonic chips, has completed a Series A+ financing round of nearly 100 million yuan. This round of funding will focus on the mass production of thin-film lithium niobate (TFLN) photonic chips and the technological layout in cutting-edge fields such as next-generation intelligent computing cluster optical interconnects, lidar, and optical computing, further solidifying Liobate Photonics' global leading position in the TFLN photonic chip domain.

　　As one of the very few companies worldwide that has mastered the full-chain core technologies of TFLN photonic chips and achieved mass production, Liobate has successfully developed TFLN electro-optic modulators with ultra-large modulation bandwidth (>110 GHz), ultra-low driving voltage (<1 V), and compact size (on the order of square millimeters), leveraging its independently controlled process platform and leading product development capabilities. These modulators serve as the core components for building various high-end photonic chips. Liobate's high-performance chips are ideal for applications such as high-speed optical interconnect networks and high-performance RF instrumentation. The company has established strategic partnerships with several global leading technology enterprises, gradually achieving the large-scale application of high-performance products, including 800G/1.6T/3.2T IMDD photonic chips for intra-cluster interconnects in intelligent computing clusters, 128G Baud PDM-IQ photonic chips for inter-cluster interconnects, and 67/110 GHz ultra-high-bandwidth intensity modulators.

　　Dr. Cai Xinlun, founder and chairman of Liobate, stated: "The evolution of AI computing clusters is currently facing three major barriers: bandwidth, power consumption, and cost. TFLN photonic chips represent a critical direction for integrated photonics to break through the bottlenecks of bandwidth and energy consumption. The TFLN photonic chips developed by Liobate are precisely the underlying technological innovation urgently needed for next-generation intelligent computing centers. The completion of this financing round signifies the capital market's high recognition of Liobate’s industrialization capabilities and the TFLN technology roadmap. Moving forward, we will accelerate the deployment of TFLN photonic chips in AI computing cluster optical interconnects, optical computing, lidar, and other fields, providing a 'photonic engine' for the global technology industry."