Ciena Brings Breakthrough Innovations for Data Center Networks to 2024 OCP Global Summit

　　Ciena (NYSE: CIEN) will showcase high-bandwidth interconnect innovations for next-generation data center designs, including the industry’s first 448G PAM4 electrical lane measurements, at the OCP Global Summit, occurring October 15–17 in San Jose, California. Visitors can meet with Ciena experts in booth #C44 to learn how the company’s WaveLogic Technologies interconnect solutions can address performance, power, and space challenges for new data center fabric and campus applications, supporting the anticipated growth in cloud, machine-to-machine, and artificial intelligence (AI)–related traffic.

　　Demonstrations (Ciena booth #C44):

　　Removing obstacles in data center design with 1.6T Coherent-Lite: Featuring Ciena’s 1.6T pluggable prototype that supports greater scalability and flexibility for data center fabric and campus applications

　　Gaining interconnect flexibility with high-performance 224G SerDes: Demonstrating Ciena’s state-of-the-art 3nm CMOS-based 224G SerDes, a functional block in Ciena’s WaveLogic 6 Nano ASIC

　　Solving tomorrow’s challenges today with 448G SerDes: Showcasing 448G electrical lane speeds using ultra-high bandwidth analog components powered by critical technology from WaveLogic 6

　　Tackling the power challenge with Liquid Cooling: Exhibiting two innovative mechanical designs for liquid-cooled coherent pluggable transceivers in an advanced technology demonstration

　　Speaking Session: Thursday, October 17, 1:20pm PDT

　　Delivering 224G SerDes with a path to 448G to address AI/ML bandwidth demand: Naim Ben-Hamida, Senior Director, Analog Engineering